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  CyberOptics LSM 300 SPI Solder Paste Inspection

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Product Code: 3203


Cyberoptics LSM 300 

Model # 8002445

Year:  2002

Serial # 3203

Offline 3D solder paste inspection / measurement system

The LSM300 follows the successful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system.LSM300 provides automatic height measurements, eliminating the inconsistencies of manual measurements and substantially improving repeatability. Additional to the height measurement theLSM300 provides dimensional x- / y-measurements, as well as area- and volume data of various pad forms.

Due to the adjustable magnification level with variable measurement range and powerful software tools theLSM300 is useful for many SMT specific application. The most common usage is measuring the wet solder paste immediately after printing. Stencil apertures can also be measured. After reflow solder joints are easily examined. Accurate and repeatable results, combined with various analysis and documentation possibilities, such as integrated SPC, make the LSM300 an effective and economical SMT-Inspection system.

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